Anna Pak


  1. Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation
    A. Pak; K. Nanbakhsh; O. Hölck; R. Ritasalo; M. Sousa; M. van Gompel; B. Pahl; J. Wilson; C. Kallmayer; V. Giagka;
    Volume 13, Issue 4, pp. 544, Marchch 2022. DOI: 10.3390/mi13040544

  2. UV and IR laser-patterning for high-density thin-film neural interfaces
    Andrada Velea; Joshua Wilson; Anna Pak; Manuel Seckel; Sven Schmidt; Stefan Kosmider; Nasim Bakhshaee; Wouter Serdijn; Vasiliki Giagka;
    In IEEE European Microelectronics and Packaging Conference (EMPC) 2021,
    Online, September 2021.

    Anna Pak; Wouter A. Serdijn; Vasiliki Giagka;
    In Book of Abstracts, 7th Dutch Biomedical Engineering Conf. (BME) 2019,
    Jan. 24-25 2019.

  4. Embedding Small Electronic Components into Tiny Flexible Implants
    Anna Pak; Wouter A. Serdijn; Vasiliki Giagka;
    In Book of Abstracts, 2019 International Winterschool on Bioelectronics Conference (BioEl 2019),
    Kirchberg, Tirol, Austria, 16-23 March 2019.

  5. Embedding small and thin electronics into flexible implants
    A. Pak; W.A. Serdijn; V. Giagka;
    In Book of Abstracts, SAFE 2019,
    Delft, the Netherlands, July 4-5 2019.

  6. Towards a Microfabricated Flexible Graphene-Based Active Implant for Tissue Monitoring During Optogenetic Spinal Cord Stimulation
    A.I. Velea; S. Vollebregt; T. Hosman; A. Pak; V. Giagka;
    In Proceedings IEEE Nanotechnology Materials and Devices Conference (NMDC) 2019,
    Stockholm, Sweden, Oct. 2019.
    Abstract: ... This work aims to develop a smart neural interface with transparent electrodes to allow for electrical monitoring of the site of interest during optogenetic stimulation of the spinal cord. In this paper, a microfabrication process for the wafer-level development of such a compact, active, transparent and flexible implant is presented. Graphene has been employed to form the transparent array of electrodes and tracks, on top of which chips have been bonded using flip-chip bonding techniques. To provide high flexibility, soft encapsulation, using polydimethylsiloxane (PDMS) has been used. Making use of the "Flex-to-Rigid" (F2R) technique, cm-size graphene-on-PDMS structures have been suspended and characterized using Raman spectroscopy to qualitatively evaluate the graphene layer, together with 2-point measurements to ensure the conductivity of the structure. In parallel, flip-chip bonding processes of chips on graphene structures were employed and the 2-point electrical measurement results have shown resistance values in the range of kΩ for the combined tracks and ball-bonds.


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