ET4391 Advanced microelectronics packaging
Microelectronic system integration and packaging provide the necessary bridge between devices and various multi-functional electronics systems. Microelectronic system integration and packaging control more than 90% of the size and 60% of the cost of microelectronic devices, as well as the system performance and reliability to a large extent. Microelectronic system integration and packaging are moreover one of the most fascinating and rapidly developing technology and business fields of semiconductors. They unquestionably play a dominant role in the development of future micro/nanoelectronics and systems.
Advanced microelectronics packaging is a multi-diciplinary course dealing with scientifically challenging and economically important technology issues. MSc students from electrical engineering, mechanical engineering, material science and physics are encouraged to attend.
Course Contents
- Introduction to microelectronics packaging
- Basics and state-of-the-art of advanced front-end and back-end technologies
- More than Moore
- International roadmaps and strategic research agenda
- Major application trends
- Levels of packaging
- Wafer-level
- 3D system integration
- Simulation and optimization for package design and reliability
- Interconnect technology and sensor packaging
- Heterogeneous systems packaging and (self-)assembly
In addition, the course offers supervised mini-projects where the students have the opportunity to get first-hand experience in developing packaging applications or review packaging technologies and application domains.
Teachers
dr. Massimo Mastrangeli (ECTM)
Organ-on-chip technology, micro/nanosystems assembly, capillary manipulation, solid-liquid interfaces
prof.dr.ir. Willem van Driel (ECTM)
Solid-state lighting reliability
dr.ing. Henk van Zeijl (ECTM)
QuoQi Zhang
Last modified: 2025-09-25
