MSc K.N. Nanbakhsh

PhD student
Bioelectronics (BE), Department of Microelectronics

Expertise: Integrated circuits and systems for implantables, biosensors and microfabrication

Themes: Electroceuticals, Flexible implants, Microsystem integration


I received my B.Sc. degree from Urmia University, Iran, and my M.Sc. degree from University of Tehran, Iran, in 2009 and 2012, respectively, all in electrical engineering. Later I moved to Eindhoven, The Netherlands, to join Sapiens Steering Brain Stimulation, a start-up company developing a high-resolution deep brain stimulation (DBS) system. After the acquisition of Sapiens by Medtronic, I continued my work as a senior scientist designing experiments to ensure long-term biostability and biocompatibility of thin-film electrodes during neural stimulation and recording.

My goal is to combine the knowledge of microelectronics and microfabrication to develop miniaturized medical devices.

During my free time, I enjoy cooking, traveling and doing sports.


  1. Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants: a comparative long-term ageing study
    C. Lamont; T. Grego; K. Nanbakhsh; A. Shah Idil; V. Giagka; A. Vanhoestenberghe; S. Cogan; N. Donaldson;
    Journal of Neural Engineering,
    March 2021.

  2. A Chip Integrity Monitor for Evaluating Moisture/Ion Ingress in mm-Sized Single-Chip Implants
    Omer Can Akgun; Kambiz Nanbakhsh; Vasiliki Giagka; Wouter Serdijn;
    IEEE Transactions on Biomedical Circuits and Systems,
    7 July 2020. DOI: 10.1109/TBCAS.2020.3007484
    Keywords: ... —Chip integrity, flexible implants, encapsulation, interlayer dielectric (ILD), silicon dioxide, resistance, time-mode, monitoring, reliability.


  3. Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implants
    K. Nanbakhsh; R. Ritasalo; W.A. Serdijn; V. Giagka;
    In Proc. IEEE Electron. Comp. Tech. Conf. (ECTC) 2020,
    Orlando, FL, USA, IEEE, May 2020.

  4. Towards CMOS Bulk Sensing for In Situ Evaluation of ALD Coatings for Millimeter Sized Implants
    K. Nanbakhsh; R. Ritasalo; W.A. Serdijn; V. Giagka;
    In Proc. 42nd Int. Conf. of the IEEE Engineering in Medicine and Biology (EMBC) 2020,
    Montreal, Canada, July 2020.

    Kambiz Nanbakhsh; Wouter Serdijn; Vasiliki Giagka;
    In Book of Abstracts, 7th Dutch Biomedical Engineering Conf. (BME) 2019,
    Jan. 24-25 2019.

  6. Polymer-Encapsulated Single-Chip Implants for Bioelectronic Medicine
    K. Nanbakhsh; W. Serdijn; V. Giagka;
    In Book of Abstracts, SAFE 2019,
    Delft, the Netherlands, July 4-5 2019.

  7. Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
    Kambiz Nanbakhsh; Marta Kluba; B. Pahl; F. Bourgeois; Ronald Dekker; Wouter Serdijn; V. Giagka;
    In Proc. 41st Int. Conf. of the IEEE Engineering in Medicine and Biology (EMBC) 2019,
    Berlin, Germany, IEEE, July 23-27 2019.

  8. A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants
    Omer Can Akgun; Kambiz Nanbakhsh; Vasiliki Giagka; Wouter A. Serdijn;
    In Proc. IEEE Biomedical Circuits and Systems Conference (BioCAS 2019),
    IEEE, October 17-19 2019.

  9. Circuit and systems for polymeric implants: designing towards increased device lifetimes
    K. Nanbakhsh; V. Giagka; W.A. Serdijn;
    In Proc. ProRISC,
    Enschede, the Netherlands, June 7-8 2018.

  10. A wireless sensor for monitoring encapsulation performance in non-hermetic implants
    K. Nanbakhsh; V. Giagka; W. A. Serdijn;
    In Proc. Design of Medical Devices Conf. (DMD) 2017 Microfabrication for Medical Devices,
    Eindhoven, 14 – 15 Nov. 2017.

BibTeX support

Last updated: 10 Jul 2019

Kambiz Nanbakhsh