Specialization profile--Microsystems

This profile is directed to the design and development of innovative devices and microsystems for various applications. It comprises technology development, hybrid device integration and application specific packaging.

Suggested courses

EE4555Active implantable biomedical microsystems5 EC details
ET4127Themes in biomedical engineering4 EC details
ET4257Sensors and actuators4 EC details
ET4260Microsystem integration4 EC details
ET4277Microelectronics reliability4 EC details
ET4278Over-sampled data converters4 EC details
ET4369Nyquist-rate data converters4 EC details
ET4390Imaging sensors5 EC details
ET4391Advanced microelectronics packaging3 EC details
ET4icpIC technology lab2 EC details

MSc project proposals

Some examples of thesis topics (this list is not exhaustive):
BE[2017] Design Rules for Implantable ASICs
ECTMHigh aspect ratio surface micro-machining using carbon nanotubes
Wafer-scale graphene transfer

Thesis examples

BE2013Eric MuijsA CMOS Temperature Compensated Log-Amp Detector
ECTM2016Brahim El MansouriA Miniaturized Temperature Controlled Capacitive MEMS Transducer for MOF based Gas Sensing Applications
2015Ramin BarakAddressing large-scale qubit arrays for quantum computer
Sotiris ThomasAn Evaluation of Silicon Carbide Based Bimorph Actuators for Optical Coherence Tomography Applications
Yingjie ShenFlexible Interposer Based on Carbon Nanotubes and PDMS Composite
Jian LiWafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration
Hengqian YiThermally Driven Sound Source: Application of CNT nanofoams
Yiwen ChenT12 Electromagnetic Ballast Modeling And Retrofit LED Tube Driver Design
Nikolas GaioFabrication and Characterization of an Upside-down CNT MEA
Ifigeneia ZachariouImplementation of a passive millimeter wave identification antenna on Kapton film for human presence detection
2014Yorick CariseyLow temperature fine pitch vertical wafer level interconnection using copper nanoparticles
Teng MaMonolithic integration of light sensor readout system for multi-functional LED wafer-level packaging based on BICMOS process
Manjunath Venkatesh RamachandrappaMonolithic Integration of Rectifiers and Drivers for low power SSL applications on a Rigid to Flex Substrate
Xingyu LiuPrinted graphene and silicon
Yi LiuNano Optomechanical Read-out for Microcantilever Sensors
Lalit KumarOpto-electronic MEMS oscillator for resonant pressure sensing
Yelena GrachovaCVD of Single Layer Graphene at Wafer Scale: Study of Different Catalytic Materials
Sourish BanerjeeSuper-growth of CNTs based on ZrN for TSV application
2013R. SokolovskijFoldable 3D Wafer Level SSL Package Using Flexible Interconnect
A. DamianLow Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D Interconnect Fabrication
Walter VerloopResonant Air Quality Sensor
Alice XuLow Temperature Fabrication of SiO2 Films Using Liquid Silicon
Dhariyash RathodVerification of the non-local avalanche current model in mextram for advanced SiGe HBTs
2012Raj VadirajHigh Frequency readout scheme for Graphene based NEMS
Miki TrifunovicSingle-Grain Silicon TFTs on a Plastic Substrate by Doctor Blade Coating of Cyclopentasilane
Ankur SharmaFlexible Smart Display with Integrated Graphics Rasterizor using Single Grain TFTs
2011Sheng Jie LiMicro-Fluidic MEMS for Micro-Particle Filtration
B.S. HauDesign & Modeling of a MEMS Contact-mode Piezoresistive Detector for Pull-in Acceleration Sensing
Amir NaeimiOLED Display with Single Grain Si TFT. (SG-TFT)
2010Gokulray ChandramohanElectrical characterization of MEMS microphones
Jie ShenNovel Application of Imprinting Lithography for Multi-bit Ferroelectric Memories
Yunlong HouAluminum Nitride and Chromium Nitride Thin Films for Strain Gauge Application
J. YangReliability study of the Floating Gate Based Embedded Non_Volatile Memory (eNVM)
J. ZhangDesign and Fabrication of On-Chip Cooling Devices Based on the Peltier Effect
M. CanEdgeless Silicon Sensors
2009D. Oludare OyediranGrowth of Thin Film Microcrystalline Silicon Solar Cells
S. VollebregtCarbon nanotubes as vertical interconnects in 3D integrated circuits
J. HaoSilicon MEMS Micro-Evaporator
Theo VerhaarPattern transfer on vertical cavity sidewalls using SU8
2008Ruoxuan LiTapered through silicon via etching and filling for 3D integration
EI2016Thije RooijersA Sampled Voltage Reference
Jeroen van DijkAn On-Chip Noise Thermometer
2015J.A. AngevareA Highly-Scalable Thermal-Diffusivity-Based Temperature Sensor
R.R. BacchuArea-Efficient Readout IC with High Panel Noise Rejection for Capacitive Touchscreens
O.E. KoleosoA CMOS Bandgap Temperature Sensor for Cryogenic Applications
W. HuA 9-bit 33MHz Hybrid SAR Single-slope ADC
N. Radeljic-JakicIntegrated Readout Circuit for Cross-Correlation Based Ultrasonic Ranging
R. BellamkondaCombined Capacitance and Temperature to Digital Converter
W.F.M. BrevetA Low-Power CMOS Wind Sensor with Corner Heaters
Y. LuoA High-Resolution, Resistor-Based Temperature Sensor
A. KulkarniLow Drift, Wireless Temperature Sensor for Harsh Industrial Applications
A.N. AbarcaHigh Precision Flow Compensated Thermal Conductivity Detector for Gas Sensing with Read-out Circuit
R. ZhangA 1-Mega Pixels HDR and UV Sensitive Image Sensor With Interleaved 14-bit 64Ms/s SAR ADC
J. MarkenhofIntegrating a Temperature Sensor into a CMOS Image Sensor
G. KarykisA high-resolution self-timed zero-crossing-based Incremental _ ADC
Q. LiuA mixed-signal multiplexing system for cable-count reduction in ultrasound probes
2014A. SelvanSimulation of optic flow based flight control for a flapping wing micro aerial vehicle
J. ZhuThe Design of a Stitched, High-dynamic Range CMOS Particle Sensor
2013L. RajendranDesign of an Energy-Efficient Interface Circuit for a MEMS-based Capacitive Pressure Sensor
N. MehtaSampling time error calibration in Time-interleaved ADCs
Y. YanAn Energy-Efficient Reconfigurable Interface for Resonant Sensors Based On Ring-Down Measurement
Q. YaoThe design of a 16*16 pixels CMOS image sensor with 0.5 e- RMS noise
J.W. Van DrielCharacterization of metals for Cochlear Implants
A. SahaDesign of Front-End Receiver Electronics for 3D Trans-Esophageal Echocardiography
2012C. ChenEnergy-Efficient Self-Timed Zero-Crossing-Based Incremental Delta-Sigma ADC
S. GoyalFrequency References Based on the Thermal Diffusivity of Silicon and Silicon Dioxide
Y. ChengEnergy-Efficient Capacitive-Sensor Interface Based on A Multi-Slope ADC
X. GeThe design of a global shutter CMOS image sensor in 110nm technology
Y. LiuThe Desigh of a High Dynamic Range CMOS Image Sensor in 110nm Technology
B.C. ChavaA Low-Input Current Chopper Amplifier
Ravi BagreeCharacterization and Design of a Readout Circuit for a Piezoelectric-based Acoustic Disdrometer
A. FekriA ratio metric analog-to-digital converter for eddy current displacement sensors
2011Z. ZengEnergy-efficient readout of resonant sensors
J. JiangDesign of a Wide-Bandwidth Magnetic Field Sensor
S.F. VoorderhakeMicro spectrometer for the measurement of the composition of new gas
J. GuoDLL Based Single Slope ADC For CMOS Image Sensor Column Readout
F.D. Roscam AbbingLight-Emitting Diode Junction-Temperature Sensing using Various Voltage/Current Measurement Techniques
K.F. TangEarly detection of anastomotic leakage using oxygen and carbon dioxide sensor
2010N. SarhangnejadHigh-precision Sigma-Delta Modulator with improved linearity
O. KayaA Precision RC-locked Oscillator
S. ChenSurface-Micromachined Thermal Conductivity Gas Sensors For Hydrogen Detection
S. SakuniaPing-Pong-Pang Instrumentation Amplifier
C. MaPixel ADC Design for Hybrid CMOS Image Sensors
M. GeljonExcitation and readout of a thermally driven time-domain optical coherence tomography system
Y. JiajianTime-Gain-Compensation Amplifier for Ultrasonic Echo Signal Processing
C. LiuA Double-mode Linear Imaging System for IC-compatible Microspectrometers in Visible Light
2009A. ChengDesign of a Readout Scheme for a MEMS Microphone
A.D.H. TierolfMicrochip electrophoresis for UVC-induced DNA damage assessment
X. GuoInvestigation on Capacitive Sensor Interface with Improved Immunity to External Interference
Y. XuCharge Domain Interlacing CMOS Image Sensor Design
P.J. NganaDesign, Modeling and Simulation of a 52MHz MEMS Gyroscope Device in 1.5um SOI

Contact person

For more information about the research group, possible thesis topics, and suggestions for your ISP:

prof.dr. Lina Sarro

Electronic Components, Technology and Materials Group

Department of Microelectronics