dr. J Wilson

1. Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation
   A. Pak; K. Nanbakhsh; O. Hölck; R. Ritasalo; M. Sousa; M. van Gompel; B. Pahl; J. Wilson; C. Kallmayer; V. Giagka;
   Micromachines,
   Volume 13, Issue 4, pp. 544, Marchch 2022. DOI: 10.3390/mi13040544
   document

2. UV and IR laser-patterning for high-density thin-film neural interfaces
   Andrada Velea; Joshua Wilson; Anna Pak; Manuel Seckel; Sven Schmidt; Stefan Kosmider; Nasim Bakhshaee; Wouter Serdijn; Vasiliki Giagka;
   In IEEE European Microelectronics and Packaging Conference (EMPC) 2021,
   Online, September 2021.
   document

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