MSc thesis project proposal

Electro-optical device for ultra-low power communication

The rapid evolution of microelectronics, materials science, and manufacturing techniques has enabled the development of smaller yet highly functional implantable devices. In fact, recently published implants integrate wireless communication, energy harvesting, and ultra-low power sensing technologies within a sub-millimeter electronic chip [1]. However, the size of the chip is starting to limit the power available and, therefore, the progression of this miniaturization path. One of the critical aspects is the powering and communication. As we reduce the chip size, the current power transfer techniques (i.e. RF, Ultrasounds) are less efficient, limiting the power available. The small footprint and the low power available also reduce communication efficiency. This project aims to tackle this problem by developing a novel ultra-low power electro-optical device based on 1D and 0D optical materials. In this project you microfabricate these highly efficient electro-optical devices and prove that a sub-100 um CMOS-chip can use it to communicate information.

[1] Chen Shi, et. A., “Application of a sub–0.1-mm3 implantable mote for in vivo real-time wireless temperature sensing.”  Sci. Adv.7,eabf6312 (2021).DOI:10.1126/sciadv.abf6312


Duration: 12 months

Location: ME Laboratories and EKL/Kavli facilities at TU Delft

You will:

  • Review the literature in this field.
  • Design a novel 1D, 0D electro-optical device.
  • Develop a fabrication flow of these devices in the EKL/Kavli cleanroom and ME facilities.
  • Characterize the devices electrically and optically showing accurate information communication with ultra-low power.


  • You are an ambitious student looking to tackle a major challenge in implantable devices.
  • You are eager to develop a new and disruptive communication transducer.
  • You have a proactive attitude.
  • You have good communication skills in English.


dr. Filipe Arroyo Cardoso

Electronic Instrumentation Group

Department of Microelectronics

Last modified: 2024-02-05