From Microstructure Image to Property: establish the process-structure-property relationship for a new interconnect material

Due to the increase in power density in high-power devices, there are higher requirements for the heat dissipation of device packaging, especially die-attach materials. Metal nano-sintering material is the most promising die-attach material in replacing solder-based materials. As well known, microstructure in nanoscale and microscale determines the properties of a material. In this project, we will start from the microstructure to explore the material properties.

Assignment

The expected activities to be carried out by the student are:

• Literature review to know the state of the art of die-attach materials.
• Prepare samples under different processes; measure thermal and mechanical properties, and characterize microstructure* (including but not limited to EBSD\SEM\FIB-SEM\3D Reconstruction).

          * If your programming skills are good, here's a free gift :-)

• Use existing models to simulate the thermal and mechanical properties of the material and compare them with experimental results.
• For different application cases, propose process parameter modification or material design suggestions.

The student will perform the assignment at ECTM*:

• Duration: ~9 months.

*Collaboration with Ampleon or other companies might be required.

Requirements

You are an ambitious student and have a microelectronics, physics, or material science background and an interest in experiment and simulation. Experience with programming is highly recommended. Good communication skills in English and a proactive attitude are expected.

Contact

Last modified: 2023-12-04