Silicon Carbide Thermal Test Chip for Characterization of Die-Attach Materials

Wide bandgap materials like silicon carbide (SiC) are one of the available materials currently used for sensors’ fabrication as they can tolerate extremely high temperatures up to 500 degree and above. SiC thermal test chip (TTC) is a novel test platform including Pt micro-heaters and RTDs for harsh environment thermal characterization. The aim of this project is the fabrication of SiC TTC at EKL using thin-film technology that enables us to transfer the current TTC design to new 4H-SiC substrates with higher thermal conductivity for future power modules.

Assignment

The expected activities to be carried out by the student are:

• Design evaluation of TTC for high temperature applications.
• Fabrication of SiC TTC at EKL using 4H-SiC wafers.
• Characterization of microheaters and RTDs.
• Thermal characterization of RTD sensors.
• IR thermography of power distribution.

Requirements

You are an ambitious master student looking for a challenging thesis project on a practical engineering problem. You have microelectronics, material science or physics background and an interest in micro fabrication technology. Good communication skills in English and a pro-active attitude are expected.

Contact

Last modified: 2024-02-27